Adhesive-based thermal management systems for medical electronics and diagnostic equipment, enabling heat dissipation in compact device designs.
Manufactured by
Oyonnax Cedex, France
GERGONNE Group is a french, industrial, family-owned and independent group based in Oyonnax, in the heart of the Plastics Vallée (Ain, France), In 2024, the Group achieved a turnover of € 97 million, almost three-quarters of which was due to exports. With 460 employees, the Group possesses the means necessary for its development while maintaining a structure with a human dimension. Serving the industry since 1962, GERGONNE offers its clients unique expertise in the manufacture and converting of technical industrial adhesive tapes, as well as the die-cutting of adhesive or non-adhesive items. Thanks to a cutting-edge multi-technology production tool, GERGONNE supplies 5 main markets of significant size : Automotive Transportation Electronics Industrial Manufacture Healthcare Construction The GERGONNE Group aims to be an efficient, responsible, innovative and sustainable industrial group. An efficient industrial group We are first and foremost manufacturers and industrialists. This is what we were born to be. The performance is no longer an option for any industrial company which intends to develop in a globalised economy. This performance is only made possible by the quality and motivation of the teams, as well as through the quality of RD and production equipment. We invest several million euros each year in our industrial tool. The GERGONNE Group committed to a CSR (Corporate Social Responsibility) approach in 2006. Convinced that sustainability is only possible within the framework of responsible growth, we strive each day to reduce our impact on the environment and to improve the safety conditions for our employees as well as their skills. Our goal is the long term. This is also true with regard to our client relationships. We have been around for 50 years, and we hope to celebrate our centenary in another 50 years !
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PLITEK® specializes in thermal management solutions, offering a range of thermal interface materials designed to enhance heat transfer between heat-generating devices and cooling plates. Effective thermal management is crucial, as excessive heat can degrade performance and damage electronic components. Our thermal interface materials are engineered to absorb and redirect heat away from critical device areas, preventing overheating and ensuring optimal operation. Key Offerings: Thermal Interface Tapes: Provide excellent adhesion and thermal conductivity for effective heat dissipation. Thermal Transfer Tapes: Facilitate heat flow between surfaces while maintaining a secure bond. Thermal Phase Change Materials: Change from solid to liquid at specific temperatures, improving heat transfer efficiency. Thermal Gap Pads: Fill gaps between surfaces to enhance thermal conductivity and reduce thermal resistance. Thermal Gap Fillers: Conform to surfaces, ensuring effective thermal transfer in uneven applications. Thermal Films: Thin materials designed for efficient heat management in compact designs. Advantages: Promotes increased life expectancy of devices Reduces emitted noise Improves energy efficiency Notably reduces costs Applications: LEDs Automotive batteries Computers Home electronics Bonding heat sinks and spreaders Attaching cooling devices to packages
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