Semiconductor-grade processing services for component fabrication including wafer cutting, COB assembly, and SMT operations. These manufacturing services support production of medical device components at precision specifications.
Manufactured by
China
OPCOM O.E., founded in 1993 in Taipei, Taiwan, is a pioneer in precision camera module packaging with over 30 years of expertise in digital imaging. The company was the first in Asia to develop precision camera module packaging and became China's earliest ISO9001-certified CCD camera module manufacturer in 1994. Utilizing proprietary ChipCAM™ packaging technology, OPCOM offers vertically integrated capabilities from wafer packaging to complete medical endoscope products, pioneering mass production of disposable endoscopes in 2004.
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